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M.M.R. Howlader, Tadatomo Suga and Moon J. Kim, “A Novel Bonding Method for Ionic Wafers”, IEEE Transactions Advanced Packaging , Nov.2007 Page(s):598-604 賴訢怡，國立清華大學材料科學與工程研究所碩士論文，“晶圓直接接郃制程物理及化學機制討論”，民國九十二年六月。