cu powder

基本解释

Tin coated flake Cu powder was obtained by electroless tin plating with hypophosphite as reducing agent.
采用次磷酸钠作还原剂，在片状铜粉表面化学镀锡，得到片状锡包铜粉。
Because the interface migration is unidirectional, so only Ni can diffuse into Cu powder and the Cu can′t diffuse almost into the Ni powder.
铜粉和镍粉在反应过程中，只有镍粉颗粒进入铜粉颗粒、铜几乎不进入镍，界面单向迁移、单向空位扩散是其密度和硬度下降的主要原因。
The results indicate that good coating quality tin coated flake Cu powder with well electric conductivity and loose specific gravity can be obtained by controlling technological parameters.
结果表明：通过控制工艺参数可以获得镀覆质量好，且具有很好导电性和低松装密度的片状锡包铜粉产品。