solder bump

基本解释

During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.
在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。
With the trend toward miniaturization, solder bumps are getting smaller, and the electric current loading of each solder bump is getting higher.
随著电子产品之微小化，焊料凸块的尺寸越来越小，而焊料凸块的电流密度也随之增大。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。