衣物護欧路词典

bed frame

B 开头单词

同根派生

     

英汉例句

  • Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
    全自動粘片機是將半導躰晶圓微芯片貼裝到引線基架的半導躰後工序關鍵性生産設備。